EP1C4F324C7N vs EP1C4F324C6N Vergleich
Detaillierter Direktvergleich von EP1C4F324C7N von Intel und EP1C4F324C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C4F324C7N | EP1C4F324C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,75 | $24,95 |
| Device Family | Cyclone | Cyclone |
| Logic Elements | 4000 | — |
| Logic Array Blocks / CLBs | 249 LABs | — |
| Total RAM Bits | 78336 bits (~9.6 KB) | 78,336 |
| Maximum User I/Os | 249 | 249 |
| PLLs | 2 | 2 |
| Package Type | FBGA-324 (FineLine BGA) | — |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.13 um SRAM-based CMOS | 130 nm |
| Speed Grade | C7 (commercial, mid-speed) | — |
| Internal Frequency (max) | 405 MHz | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| RoHS-Status | Compliant (lead-free FBGA) | — |
| Montageart | Surface Mount | — |
| Logic Elements (LE) | — | 4,000 |
| Logic Array Blocks (LAB) | — | 400 |
| Embedded Multipliers (17x17) | — | 20 |
| M4K RAM Blocks | — | 17 |
| Global Clock Networks | — | 8 |
| Internal Operating Frequency | — | 405 MHz |
| Gehäuse | — | 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch |
| Configuration Method | — | SRAM-based, JTAG/Active Serial |