EP1C4F324C7N vs EP1C4F324C6N Comparación
Comparación detallada lado a lado de EP1C4F324C7N por Intel y EP1C4F324C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C4F324C7N | EP1C4F324C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,75 | $24,95 |
| Device Family | Cyclone | Cyclone |
| Logic Elements | 4000 | — |
| Logic Array Blocks / CLBs | 249 LABs | — |
| Total RAM Bits | 78336 bits (~9.6 KB) | 78,336 |
| Maximum User I/Os | 249 | 249 |
| PLLs | 2 | 2 |
| Package Type | FBGA-324 (FineLine BGA) | — |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.13 um SRAM-based CMOS | 130 nm |
| Speed Grade | C7 (commercial, mid-speed) | — |
| Internal Frequency (max) | 405 MHz | — |
| Configuration Modes | Passive Serial, Active Serial, JTAG | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Estado RoHS | Compliant (lead-free FBGA) | — |
| Tipo de montaje | Surface Mount | — |
| Logic Elements (LE) | — | 4,000 |
| Logic Array Blocks (LAB) | — | 400 |
| Embedded Multipliers (17x17) | — | 20 |
| M4K RAM Blocks | — | 17 |
| Global Clock Networks | — | 8 |
| Internal Operating Frequency | — | 405 MHz |
| Encapsulado | — | 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch |
| Configuration Method | — | SRAM-based, JTAG/Active Serial |