EP1K100FI256-2N vs EP1K50FC256-2N Vergleich
Detaillierter Direktvergleich von EP1K100FI256-2N von Intel und EP1K50FC256-2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1K100FI256-2N | EP1K50FC256-2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,80 | $17,95 |
| Family | ACEX 1K | ACEX-1K |
| Series | EP1K100 | — |
| Logic Elements | 4,992 | — |
| System Gates | 100,000 | — |
| Logic Array Blocks (LABs) | 624 | 360 |
| Embedded Array Blocks (EABs) | 6 | 10 |
| Total RAM Bits | 49,152 | — |
| Maximum User I/O | 186 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| Speed Grade | -2 (faster bin) | -2 |
| Ball Finish | Leaded (SnPb) - 'N' suffix | — |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) | 0 °C to 70 °C (Commercial) |
| Gehäuse | 256-ball FineLine BGA (FBGA-256) | 256-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG (IEEE 1149.1) + serial modes | — |
| RoHS-Status | Non-compliant (leaded 'N' ball finish) | [DATA_NEEDED: RoHS status] |
| Logic Elements (LEs) | — | 2,880 |
| Typical Gates | — | 50,000 |
| Embedded Memory (bits) | — | 40,960 |
| Maximum User I/O Pins | — | 186 |
| Core Voltage (VCCINT) | — | 2.5 V (2.375 V to 2.625 V) |
| Package Dimensions | — | 16 x 16 mm |
| Configuration Method | — | JTAG / Passive Serial |