EP1K30FC256-1N vs EP1K30FC256-1 Vergleich

Detaillierter Direktvergleich von EP1K30FC256-1N von Intel und EP1K30FC256-1 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1K30FC256-1N EP1K30FC256-1
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $13,95 $17,85
Family ACEX-1K ACEX-1K
Logic Elements 1,728 17,280
Typical Gates 30,000 30,000
Embedded RAM Bits 24,576 24,576
Maximum User I/O 171 —
Supply Voltage - Core 2.5 V —
Number of I/O Banks [DATA_NEEDED: I/O banks] —
Betriebstemperatur 0C to +70C (commercial) —
Speed Grade -1 -1 (standard, slowest in family)
Montageart Surface Mount Surface Mount (BGA)
Gehäuse 256-BGA (FineLine BGA, 17x17 mm) 256-pin FineLine BGA (FBGA)
Process Technology 0.22 um SRAM CMOS 2.5 V CMOS
Configuration Method SRAM (external PROM required) —
Programming Interface JTAG (IEEE 1149.1) —
Lead Free / RoHS Lead free per Altera/Intel product declaration —
MSL-Level [DATA_NEEDED: MSL rating] —
Internal Max Frequency up to 250 MHz (family typical) —
Logic Cells — 1,728
User I/O Pins — 171
Logic Array Blocks (LABs) — 216
Embedded Array Blocks (EABs) — 6
Core Voltage (VCCINT) — 2.5 V
I/O Voltage (VCCIO) — 3.3 V / 2.5 V (multi-voltage)
Operating Temperature Grade — Commercial (0C to +70C)
Maximum Internal Frequency — 250 MHz (per family datasheet)
Configuration Interface — Passive Serial / Passive Parallel / JTAG
Programming Method — SRAM-based, in-system programmable
RoHS-Status — Compliant

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