EP1K30FC256-1N vs EP1K30FC256-3NAA Vergleich

Detaillierter Direktvergleich von EP1K30FC256-1N von Intel und EP1K30FC256-3NAA von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1K30FC256-1N EP1K30FC256-3NAA
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $13,95 $11,50
Family ACEX-1K ACEX-1K
Logic Elements 1,728 —
Typical Gates 30,000 —
Embedded RAM Bits 24,576 24576 bits
Maximum User I/O 171 —
Supply Voltage - Core 2.5 V —
Number of I/O Banks [DATA_NEEDED: I/O banks] —
Betriebstemperatur 0C to +70C (commercial) —
Speed Grade -1 -3 (ordering code)
Montageart Surface Mount Surface Mount
Gehäuse 256-BGA (FineLine BGA, 17x17 mm) —
Process Technology 0.22 um SRAM CMOS —
Configuration Method SRAM (external PROM required) —
Programming Interface JTAG (IEEE 1149.1) —
Lead Free / RoHS Lead free per Altera/Intel product declaration —
MSL-Level [DATA_NEEDED: MSL rating] —
Internal Max Frequency up to 250 MHz (family typical) —
Product Category — FPGA - Field Programmable Gate Array
Number of Logic Elements — 1728
Number of Gates — 30000 (30K)
Number of User I/Os — 171
Maximum Internal Clock Frequency — 200 MHz
Core Supply Voltage — 2.5 V
IC Process Technology — 0.22 um
Package Type — 256-ball FBGA (FineLine BGA)
Package Form — 256-BBGA
Configuration Type — SRAM-based, external configuration device required
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]
I/O Supply Voltage — [DATA_NEEDED: VCCIO voltage options]
Power Dissipation — [DATA_NEEDED: typical power dissipation, design dependent]
Lead-Free / RoHS — [DATA_NEEDED: manufacturer PCN confirms RoHS status]

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