EP1K30FC256-1N vs EP1K30FC256-3NAA Comparison

Detailed side-by-side comparison of EP1K30FC256-1N by Intel and EP1K30FC256-3NAA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FC256-1N EP1K30FC256-3NAA
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX-1K ACEX-1K
Logic Elements 1,728 —
Typical Gates 30,000 —
Embedded RAM Bits 24,576 24576 bits
Maximum User I/O 171 —
Supply Voltage - Core 2.5 V —
Number of I/O Banks [DATA_NEEDED: I/O banks] —
Operating Temperature 0C to +70C (commercial) —
Speed Grade -1 -3 (ordering code)
Mounting Type Surface Mount Surface Mount
Package 256-BGA (FineLine BGA, 17x17 mm) —
Process Technology 0.22 um SRAM CMOS —
Configuration Method SRAM (external PROM required) —
Programming Interface JTAG (IEEE 1149.1) —
Lead Free / RoHS Lead free per Altera/Intel product declaration —
MSL Level [DATA_NEEDED: MSL rating] —
Internal Max Frequency up to 250 MHz (family typical) —
Product Category — FPGA - Field Programmable Gate Array
Number of Logic Elements — 1728
Number of Gates — 30000 (30K)
Number of User I/Os — 171
Maximum Internal Clock Frequency — 200 MHz
Core Supply Voltage — 2.5 V
IC Process Technology — 0.22 um
Package Type — 256-ball FBGA (FineLine BGA)
Package Form — 256-BBGA
Configuration Type — SRAM-based, external configuration device required
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
I/O Supply Voltage — [DATA_NEEDED: VCCIO voltage options]
Power Dissipation — [DATA_NEEDED: typical power dissipation, design dependent]
Lead-Free / RoHS — [DATA_NEEDED: manufacturer PCN confirms RoHS status]

Datasheets & Resources

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