EP1K30FC256-3NAA vs EP1K30FI256-2N Vergleich
Detaillierter Direktvergleich von EP1K30FC256-3NAA von Intel und EP1K30FI256-2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1K30FC256-3NAA | EP1K30FI256-2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,50 | $18,40 |
| Product Category | FPGA - Field Programmable Gate Array | — |
| Family | ACEX-1K | ACEX-1K |
| Number of Logic Elements | 1728 | — |
| Number of Gates | 30000 (30K) | — |
| Embedded RAM Bits | 24576 bits | 24,576 |
| Number of User I/Os | 171 | — |
| Maximum Internal Clock Frequency | 200 MHz | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| IC Process Technology | 0.22 um | — |
| Package Type | 256-ball FBGA (FineLine BGA) | — |
| Package Form | 256-BBGA | — |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | -3 (ordering code) | -2 |
| Configuration Type | SRAM-based, external configuration device required | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| I/O Supply Voltage | [DATA_NEEDED: VCCIO voltage options] | — |
| Power Dissipation | [DATA_NEEDED: typical power dissipation, design dependent] | — |
| Lead-Free / RoHS | [DATA_NEEDED: manufacturer PCN confirms RoHS status] | — |
| Typical Gates | — | 30,000 |
| Logic Elements (LEs) | — | 1,728 |
| Maximum User I/O | — | 171 |
| Process Technology | — | 0.22 µm CMOS |
| Maximum Internal Frequency | — | 200 MHz |
| Number of LABs | — | 216 |
| Gehäuse | — | 256-ball FineLine BGA (FBGA) |
| Operating Temperature Grade | — | Industrial |
| Programmable via | — | JTAG (IEEE 1149.1) |
| Speichertyp | — | Dual-port Embedded Array Block (EAB) |