EP1K30FC256-3NAA vs EP1K30FI256-2N Comparison
Detailed side-by-side comparison of EP1K30FC256-3NAA by Intel and EP1K30FI256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K30FC256-3NAA | EP1K30FI256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $11.50 | $18.40 |
| Product Category | FPGA - Field Programmable Gate Array | β |
| Family | ACEX-1K | ACEX-1K |
| Number of Logic Elements | 1728 | β |
| Number of Gates | 30000 (30K) | β |
| Embedded RAM Bits | 24576 bits | 24,576 |
| Number of User I/Os | 171 | β |
| Maximum Internal Clock Frequency | 200 MHz | β |
| Core Supply Voltage | 2.5 V | 2.5 V |
| IC Process Technology | 0.22 um | β |
| Package Type | 256-ball FBGA (FineLine BGA) | β |
| Package Form | 256-BBGA | β |
| Mounting Type | Surface Mount | Surface Mount |
| Speed Grade | -3 (ordering code) | -2 |
| Configuration Type | SRAM-based, external configuration device required | β |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | β |
| I/O Supply Voltage | [DATA_NEEDED: VCCIO voltage options] | β |
| Power Dissipation | [DATA_NEEDED: typical power dissipation, design dependent] | β |
| Lead-Free / RoHS | [DATA_NEEDED: manufacturer PCN confirms RoHS status] | β |
| Typical Gates | β | 30,000 |
| Logic Elements (LEs) | β | 1,728 |
| Maximum User I/O | β | 171 |
| Process Technology | β | 0.22 Β΅m CMOS |
| Maximum Internal Frequency | β | 200 MHz |
| Number of LABs | β | 216 |
| Package | β | 256-ball FineLine BGA (FBGA) |
| Operating Temperature Grade | β | Industrial |
| Programmable via | β | JTAG (IEEE 1149.1) |
| Memory Type | β | Dual-port Embedded Array Block (EAB) |