EP1K50FC256-2N vs EP1K100FI256-2N Vergleich
Detaillierter Direktvergleich von EP1K50FC256-2N von Intel und EP1K100FI256-2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1K50FC256-2N | EP1K100FI256-2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $17,95 | $55,80 |
| Family | ACEX-1K | ACEX 1K |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | — |
| Embedded Memory (bits) | 40,960 | — |
| Embedded Array Blocks (EABs) | 10 | 6 |
| Logic Array Blocks (LABs) | 360 | 624 |
| Maximum User I/O Pins | 186 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| Betriebstemperatur | 0 °C to 70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Speed Grade | -2 | -2 (faster bin) |
| Gehäuse | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA-256) |
| Package Dimensions | 16 x 16 mm | — |
| Configuration Method | JTAG / Passive Serial | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Non-compliant (leaded 'N' ball finish) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Series | — | EP1K100 |
| Logic Elements | — | 4,992 |
| System Gates | — | 100,000 |
| Total RAM Bits | — | 49,152 |
| Maximum User I/O | — | 186 |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Ball Finish | — | Leaded (SnPb) - 'N' suffix |
| Configuration Interface | — | JTAG (IEEE 1149.1) + serial modes |