EP1M120B484C5 vs EP1M120F484C6 Vergleich
Detaillierter Direktvergleich von EP1M120B484C5 von Intel und EP1M120F484C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1M120B484C5 | EP1M120F484C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $65,00 | $198,00 |
| Family | Mercury (EP1M) | Mercury (APEX EP1M) |
| Logic Elements | 4,800 | — |
| Typical Gates | 120,000 | 120,000 |
| Maximum User I/O | 303 | — |
| Gehäuse | FineLine BGA-484 (19 mm x 19 mm, 1.0 mm pitch) | 484-ball FC-FBGA (FineLine BGA) |
| Betriebstemperatur | 0C to +85C (commercial) | 0 C to +85 C (Commercial) |
| Speed Grade | 5 (slowest) | — |
| Core Voltage | 1.8 V | — |
| Process Technology | 0.18 um CMOS | [DATA_NEEDED: process node] |
| PLLs | 4 | — |
| Embedded RAM Bits | 49,152 | — |
| True LVDS Channels | Up to 34 pairs | — |
| Maximum LVDS Data Rate | 840 Mbps per channel | — |
| Configuration Scheme | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG | — |
| Peak Reflow Temperature | 220 C | — |
| Lead-Free / RoHS | SnPb ball finish (non-RoHS by default) | — |
| Multipliers | Embedded in system blocks for DSP | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Logic Cells | — | 4,800 |
| Logic Elements (LEs) | — | 49,152 (per distributor listing) |
| User I/O | — | 303 |
| Logic Array Blocks (LABs) | — | 480 |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| Core Supply Voltage | — | 1.8 V |
| Logic Family | — | CMOS |
| Integrated Transceivers | — | High-speed CDR to 1.25 Gbps |
| Embedded System Blocks (ESBs) | — | Yes (dual-port RAM / ROM / CAM) |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |