EP1M120B484C5 vs EP1M120F484C6 Comparación
Comparación detallada lado a lado de EP1M120B484C5 por Intel y EP1M120F484C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1M120B484C5 | EP1M120F484C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $65,00 | $198,00 |
| Family | Mercury (EP1M) | Mercury (APEX EP1M) |
| Logic Elements | 4,800 | — |
| Typical Gates | 120,000 | 120,000 |
| Maximum User I/O | 303 | — |
| Encapsulado | FineLine BGA-484 (19 mm x 19 mm, 1.0 mm pitch) | 484-ball FC-FBGA (FineLine BGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0 C to +85 C (Commercial) |
| Speed Grade | 5 (slowest) | — |
| Core Voltage | 1.8 V | — |
| Process Technology | 0.18 um CMOS | [DATA_NEEDED: process node] |
| PLLs | 4 | — |
| Embedded RAM Bits | 49,152 | — |
| True LVDS Channels | Up to 34 pairs | — |
| Maximum LVDS Data Rate | 840 Mbps per channel | — |
| Configuration Scheme | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG | — |
| Peak Reflow Temperature | 220 C | — |
| Lead-Free / RoHS | SnPb ball finish (non-RoHS by default) | — |
| Multipliers | Embedded in system blocks for DSP | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Logic Cells | — | 4,800 |
| Logic Elements (LEs) | — | 49,152 (per distributor listing) |
| User I/O | — | 303 |
| Logic Array Blocks (LABs) | — | 480 |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| Core Supply Voltage | — | 1.8 V |
| Logic Family | — | CMOS |
| Integrated Transceivers | — | High-speed CDR to 1.25 Gbps |
| Embedded System Blocks (ESBs) | — | Yes (dual-port RAM / ROM / CAM) |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |