EP1M120F484C6 vs EP1M120B484C6 Vergleich
Detaillierter Direktvergleich von EP1M120F484C6 von Intel und EP1M120B484C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1M120F484C6 | EP1M120B484C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $198,00 | $55,00 |
| Family | Mercury (APEX EP1M) | Mercury (ACEX 1M) |
| Typical Gates | 120,000 | — |
| Logic Cells | 4,800 | — |
| Logic Elements (LEs) | 49,152 (per distributor listing) | — |
| User I/O | 303 | — |
| Logic Array Blocks (LABs) | 480 | — |
| Gehäuse | 484-ball FC-FBGA (FineLine BGA) | 484-ball FineLine BGA (BGA-484) |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Core Supply Voltage | 1.8 V | — |
| Logic Family | CMOS | — |
| Betriebstemperatur | 0 C to +85 C (Commercial) | — |
| Integrated Transceivers | High-speed CDR to 1.25 Gbps | — |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM / ROM / CAM) | — |
| Process Technology | [DATA_NEEDED: process node] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements (typical) | — | 120 LE |
| Maximum Logic Elements | — | [DATA_NEEDED: maximum logic elements] |
| Flip-Flops | — | 4,800 |
| User I/O Pins (max) | — | 303 |
| Configuration Memory | — | SRAM-based (volatile, re-load on power-up) |
| Peak Reflow Temperature | — | 220 °C |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Process Node | — | 0.18 µm |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Configuration Modes | — | PS, AS, JTAG |
| Design Software | — | Quartus II (legacy support required) |