EP1M120F484C6 vs EP1M120B484C6 Comparaison
Comparaison détaillée côte à côte de EP1M120F484C6 par Intel et EP1M120B484C6 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1M120F484C6 | EP1M120B484C6 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $55,00 |
| Family | Mercury (APEX EP1M) | Mercury (ACEX 1M) |
| Typical Gates | 120,000 | — |
| Logic Cells | 4,800 | — |
| Logic Elements (LEs) | 49,152 (per distributor listing) | — |
| User I/O | 303 | — |
| Logic Array Blocks (LABs) | 480 | — |
| Boîtier | 484-ball FC-FBGA (FineLine BGA) | 484-ball FineLine BGA (BGA-484) |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Core Supply Voltage | 1.8 V | — |
| Logic Family | CMOS | — |
| Température de fonctionnement | 0 C to +85 C (Commercial) | — |
| Integrated Transceivers | High-speed CDR to 1.25 Gbps | — |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM / ROM / CAM) | — |
| Process Technology | [DATA_NEEDED: process node] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Logic Elements (typical) | — | 120 LE |
| Maximum Logic Elements | — | [DATA_NEEDED: maximum logic elements] |
| Flip-Flops | — | 4,800 |
| User I/O Pins (max) | — | 303 |
| Configuration Memory | — | SRAM-based (volatile, re-load on power-up) |
| Peak Reflow Temperature | — | 220 °C |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Process Node | — | 0.18 µm |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Configuration Modes | — | PS, AS, JTAG |
| Design Software | — | Quartus II (legacy support required) |