EP1M350F780C7N vs EP1M350F780C7ES Vergleich
Detaillierter Direktvergleich von EP1M350F780C7N von Intel und EP1M350F780C7ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1M350F780C7N | EP1M350F780C7ES |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $168,00 | $0,00 |
| Family | Mercury (EP1M350) | — |
| Device Type | FPGA / Loadable PLD | — |
| Logic Cells | 14,400 | — |
| Gate Count | 350,000 | — |
| Core Supply Voltage | 1.8 V | — |
| User I/Os | 486 | — |
| Total Pins | 780 | — |
| Package Type | FC-FBGA / FINE LINE BGA-780 | FINE LINE BGA-780 |
| Terminal Pitch | 1.0 mm | — |
| Speed Grade | C7 (-7 commercial) | — |
| Betriebstemperatur | 0 C to 85 C (commercial) | 0 C to 85 C |
| Logic Family | CMOS | CMOS |
| Transceivers | Up to 18 channels, 1.25 Gbps CDR | — |
| Architecture | LUT-based, register-rich | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Category | — | 780-BBGA |
| Versorgungsspannung | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| Montageart | — | Surface Mount |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Wärmewiderstand | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |