EP1M350F780C7N vs EP1M350F780C7ES Comparaison
Comparaison détaillée côte à côte de EP1M350F780C7N par Intel et EP1M350F780C7ES par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1M350F780C7N | EP1M350F780C7ES |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $168,00 | $0,00 |
| Family | Mercury (EP1M350) | — |
| Device Type | FPGA / Loadable PLD | — |
| Logic Cells | 14,400 | — |
| Gate Count | 350,000 | — |
| Core Supply Voltage | 1.8 V | — |
| User I/Os | 486 | — |
| Total Pins | 780 | — |
| Package Type | FC-FBGA / FINE LINE BGA-780 | FINE LINE BGA-780 |
| Terminal Pitch | 1.0 mm | — |
| Speed Grade | C7 (-7 commercial) | — |
| Température de fonctionnement | 0 C to 85 C (commercial) | 0 C to 85 C |
| Logic Family | CMOS | CMOS |
| Transceivers | Up to 18 channels, 1.25 Gbps CDR | — |
| Architecture | LUT-based, register-rich | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Category | — | 780-BBGA |
| Tension d'alimentation | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| Type de montage | — | Surface Mount |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Résistance thermique | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |