EP1M350F780C8 vs EP1M350F780C7ES Vergleich

Detaillierter Direktvergleich von EP1M350F780C8 von Altera und EP1M350F780C7ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP1M350F780C7ES EP1M350F780C7ES - 486-I/O Mercury FPGA | Intel

EP1M350F780C7ES - 486-I/O Mercury FPGA | Intel

EP1M350F780C7ES ✓ Aktiv

Spezifikationsvergleich

Parameter EP1M350F780C8 EP1M350F780C7ES
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $175,00 $0,00
Device Family Altera APEX Mercury (EP1M) —
Typical Gates 350,000 —
Maximum Logic Elements (LEs) 12,160 —
Embedded RAM Blocks 4 dual-port RAM blocks —
Gehäuse 780-ball FineLine BGA —
Speed Grade C8 (commercial, speed bin 8) —
Betriebstemperatur 0C to +85C (commercial) 0 C to 85 C
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
I/O Standards Supported LVTTL, LVCMOS, PCI, SSTL, LVDS (up to 20 standards) —
Global Clock Networks 8 —
Configuration Interface IEEE 1532 / passive serial / JTAG —
Maximum User I/O [DATA_NEEDED: user I/O count] —
In-System Programmability Yes (ISP via JTAG) —
RoHS-Status unknown (legacy device) unknown
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL rating] —
Product Type — Field Programmable Gate Array (FPGA)
Logic Family — CMOS
User I/O Count — 486 pins
Total Package Pins — 780 pins
Package Type — FINE LINE BGA-780
Package Category — 780-BBGA
Versorgungsspannung — 1.8 V
Maximum Stated Transceiver Data Rate — 1.25 Gbps
Channels Supported at 1.25 Gbps — 8 channels
Remaining Channel Limit — 10 channels at 1.0 Gbps or less
Clock Data Recovery — Supported
High-Speed Transceivers — Integrated
REACH Status — unknown
Logic Element Count — [DATA_NEEDED: logic element count]
Embedded Memory Capacity — [DATA_NEEDED: embedded memory capacity]
Transceiver Count — [DATA_NEEDED: transceiver count]
Package Dimensions — [DATA_NEEDED: package dimensions]
Wärmewiderstand — [DATA_NEEDED: junction-to-ambient thermal resistance]

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