EP1M350F780C8 vs EP1M350F780C7ES Сравнение
Подробное сравнение бок о бок EP1M350F780C8 от Altera и EP1M350F780C7ES от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP1M350F780C8 | EP1M350F780C7ES |
|---|---|---|
| Бренд | Altera | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $175,00 | $0,00 |
| Device Family | Altera APEX Mercury (EP1M) | — |
| Typical Gates | 350,000 | — |
| Maximum Logic Elements (LEs) | 12,160 | — |
| Embedded RAM Blocks | 4 dual-port RAM blocks | — |
| Корпус | 780-ball FineLine BGA | — |
| Speed Grade | C8 (commercial, speed bin 8) | — |
| Рабочая температура | 0C to +85C (commercial) | 0 C to 85 C |
| Supply Voltage (Core) | [DATA_NEEDED: core Vcc] | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL, LVDS (up to 20 standards) | — |
| Global Clock Networks | 8 | — |
| Configuration Interface | IEEE 1532 / passive serial / JTAG | — |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| In-System Programmability | Yes (ISP via JTAG) | — |
| Статус RoHS | unknown (legacy device) | unknown |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Уровень MSL | [DATA_NEEDED: MSL rating] | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Family | — | CMOS |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| Напряжение питания | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Тепловое сопротивление | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |