EP1M350F780I6 vs EP1M350F780C7ES Vergleich
Detaillierter Direktvergleich von EP1M350F780I6 von Altera und EP1M350F780C7ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1M350F780I6 | EP1M350F780C7ES |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $210,00 | $0,00 |
| Family | Mercury (PLD) | — |
| Logic Cells | 14,400 | — |
| Equivalent Gates | 350,000 | — |
| User I/Os | 486 | — |
| Embedded Memory (bits) | 114,688 | — |
| Core Supply Voltage | 1.8 V | — |
| Gehäuse | 780-ball FC-FBGA (Fine-line) | — |
| Betriebstemperatur | 0 C to 85 C (Industrial) | 0 C to 85 C |
| Process Technology | CMOS | — |
| Multi-Gigabit Transceivers | Up to 1.25 Gbps with embedded CDR | — |
| Configuration | JTAG (IEEE 1149.1) / Active Serial (EPC) | — |
| LAB Count | 1,440 (per Mouser listing) | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Family | — | CMOS |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| Versorgungsspannung | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Wärmewiderstand | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |