EP1M350F780I6 vs EP1M350F780C7ES Сравнение
Подробное сравнение бок о бок EP1M350F780I6 от Altera и EP1M350F780C7ES от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP1M350F780I6 | EP1M350F780C7ES |
|---|---|---|
| Бренд | Altera | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $210,00 | $0,00 |
| Family | Mercury (PLD) | — |
| Logic Cells | 14,400 | — |
| Equivalent Gates | 350,000 | — |
| User I/Os | 486 | — |
| Embedded Memory (bits) | 114,688 | — |
| Core Supply Voltage | 1.8 V | — |
| Корпус | 780-ball FC-FBGA (Fine-line) | — |
| Рабочая температура | 0 C to 85 C (Industrial) | 0 C to 85 C |
| Process Technology | CMOS | — |
| Multi-Gigabit Transceivers | Up to 1.25 Gbps with embedded CDR | — |
| Configuration | JTAG (IEEE 1149.1) / Active Serial (EPC) | — |
| LAB Count | 1,440 (per Mouser listing) | — |
| Тип монтажа | Surface Mount | Surface Mount |
| Уровень MSL | [DATA_NEEDED: MSL rating] | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Family | — | CMOS |
| User I/O Count | — | 486 pins |
| Total Package Pins | — | 780 pins |
| Package Type | — | FINE LINE BGA-780 |
| Package Category | — | 780-BBGA |
| Напряжение питания | — | 1.8 V |
| Maximum Stated Transceiver Data Rate | — | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | — | 8 channels |
| Remaining Channel Limit | — | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | — | Supported |
| High-Speed Transceivers | — | Integrated |
| REACH Status | — | unknown |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | — | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |
| Тепловое сопротивление | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |