EP1M350F780I6AA vs EP1M350F780C7 Vergleich
Detaillierter Direktvergleich von EP1M350F780I6AA von Intel und EP1M350F780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1M350F780I6AA | EP1M350F780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $165,00 | $162,00 |
| Family | Mercury | Mercury (PLD) |
| Device Logic Elements / Cells | 14,400 | — |
| Number of Gates | 350K system gates | — |
| Betriebsversorgungsspannung | 1.8 V core | — |
| User I/O Count | 486 | — |
| Gehäuse | 780-Ball FC-FBGA | 780-ball FineLine BGA (F780) |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | 6 (slowest) | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free Assembly | Yes (AA suffix) | — |
| Embedded Transceivers | Yes (high-speed differential with CDR support) | — |
| Configuration Method | Serial / Parallel via EPC configuration device | JTAG / Quartus II |
| Process Technology | 0.13 µm CMOS | CMOS SRAM-based |
| Supplier Device Package | 780-FBGA | — |
| Device Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Logic Array Blocks (LABs) | — | 1440 |
| System Gates | — | 350,000 |
| Maximum User I/Os | — | 486 |
| Package Type | — | FINE LINE BGA-780 |
| Supply Voltage (Core) | — | 1.8 V |
| Logic Family | — | CMOS |
| Betriebstemperatur | — | 0 C to 85 C (Commercial) |
| Transceivers / CDR Support | — | Up to 1.25 Gbps with CDR |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |