EP1M350F780I6AA vs EP1M350F780C7 Comparación
Comparación detallada lado a lado de EP1M350F780I6AA por Intel y EP1M350F780C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1M350F780I6AA | EP1M350F780C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $162,00 |
| Family | Mercury | Mercury (PLD) |
| Device Logic Elements / Cells | 14,400 | — |
| Number of Gates | 350K system gates | — |
| Tensión de alimentación de funcionamiento | 1.8 V core | — |
| User I/O Count | 486 | — |
| Encapsulado | 780-Ball FC-FBGA | 780-ball FineLine BGA (F780) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Speed Grade | 6 (slowest) | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Lead-Free Assembly | Yes (AA suffix) | — |
| Embedded Transceivers | Yes (high-speed differential with CDR support) | — |
| Configuration Method | Serial / Parallel via EPC configuration device | JTAG / Quartus II |
| Process Technology | 0.13 µm CMOS | CMOS SRAM-based |
| Supplier Device Package | 780-FBGA | — |
| Device Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Logic Array Blocks (LABs) | — | 1440 |
| System Gates | — | 350,000 |
| Maximum User I/Os | — | 486 |
| Package Type | — | FINE LINE BGA-780 |
| Supply Voltage (Core) | — | 1.8 V |
| Logic Family | — | CMOS |
| Temperatura de funcionamiento | — | 0 C to 85 C (Commercial) |
| Transceivers / CDR Support | — | Up to 1.25 Gbps with CDR |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |