EP1SGX10DF672C5N vs EP1SGX10DF672I6 Vergleich

Detaillierter Direktvergleich von EP1SGX10DF672C5N von Intel und EP1SGX10DF672I6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP1SGX10DF672C5N EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel

EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel

EP1SGX10DF672C5N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP1SGX10DF672C5N EP1SGX10DF672I6
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $192,00 $290,00
Family Stratix GX Stratix GX
Logic Cells 10,570 —
Logic Array Blocks (LABs) 1,057 —
Configurable Logic Blocks 1,200 —
User I/Os 362 —
On-chip RAM 920,448 bits —
Supply Voltage (Core, VCCINT) 1.5 V nominal (1.425 V to 1.575 V) —
Technology 130 nm CMOS —
Betriebstemperatur 0 C to 85 C (Commercial) 0 C to +85 C (commercial)
Gehäuse 672-ball FC-FBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch 672-ball FC-FBGA (DF672)
Montageart Surface Mount (Flip-Chip BGA) Surface Mount
Logic Family CMOS —
Configuration Passive Serial / Passive Parallel / JTAG / Altera Serial —
RoHS-Status Compliant (FBGA package) [DATA_NEEDED: RoHS Status]
High-Speed Transceivers Embedded GX transceivers (data rate not specified in provided data [DATA_NEEDED: transceiver count and max data rate]) —
Logic Elements (LEs) — 10,570
Embedded RAM — 920,448 bits
Embedded Multipliers — Yes (DSP blocks)
Transceiver Channels — 12 (3.125 Gbps)
Maximum User I/O — 362
PLLs — 4
Process Technology — 130 nm CMOS
Core Supply Voltage — 1.5 V
Package Body Size — 33 x 33 mm, 1.0 mm pitch
MSL-Level — [DATA_NEEDED: MSL Level]

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