EP1SGX25DF672C7ES vs EP1SGX25DF672C6 Vergleich
Detaillierter Direktvergleich von EP1SGX25DF672C7ES von Intel und EP1SGX25DF672C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1SGX25DF672C7ES | EP1SGX25DF672C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $96,50 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Stratix GX | — |
| Logic Cells | 25,660 cells | — |
| Logic Family | CMOS | — |
| Process Technology | 130 nm | CMOS |
| Versorgungsspannung | 1.5 V | — |
| I/O Count | 455 I/O | — |
| Listed Clock Frequency | 4385.97 MHz | — |
| Secondary Listed Maximum Clock | 4.7 MHz | — |
| High-Speed Serial Data Rate | 500 Mbps to 3.1875 Gbps | — |
| High-Speed Serial Direction | Full-duplex | — |
| Available Family Transceiver Configurations | 4, 8, 16, or 20 channels | — |
| Maximum Family Transceiver Bandwidth | 127.5 Gbps full-duplex | — |
| Gehäuse | 672-pin FC-FBGA | 672-BBGA FineLine BGA |
| Alternate Package Description | FBGA-1020, 33 mm x 33 mm, 1 mm pitch | — |
| Betriebstemperatur | 0 °C to 85 °C | 0C to +85C (commercial) |
| Lead-Free Status | Lead-free | — |
| Series | — | Stratix GX |
| Logic Elements | — | 25,660 LE |
| Number of LABs | — | 2,566 |
| Total RAM Bits | — | 1,944,576 bits |
| User I/O Count | — | 455 |
| Number of Transceivers | — | 6 channels (per Stratix GX family) |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| Core Voltage | — | 1.5 V |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Montageart | — | Surface Mount |
| Lead-Free / RoHS | — | Lead-Free (per FBGA suffix family) |