EP1SGX25DF672C7ES vs EP1SGX25DF672C6 Comparación
Comparación detallada lado a lado de EP1SGX25DF672C7ES por Intel y EP1SGX25DF672C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1SGX25DF672C7ES | EP1SGX25DF672C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $96,50 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Stratix GX | — |
| Logic Cells | 25,660 cells | — |
| Logic Family | CMOS | — |
| Process Technology | 130 nm | CMOS |
| Tensión de alimentación | 1.5 V | — |
| I/O Count | 455 I/O | — |
| Listed Clock Frequency | 4385.97 MHz | — |
| Secondary Listed Maximum Clock | 4.7 MHz | — |
| High-Speed Serial Data Rate | 500 Mbps to 3.1875 Gbps | — |
| High-Speed Serial Direction | Full-duplex | — |
| Available Family Transceiver Configurations | 4, 8, 16, or 20 channels | — |
| Maximum Family Transceiver Bandwidth | 127.5 Gbps full-duplex | — |
| Encapsulado | 672-pin FC-FBGA | 672-BBGA FineLine BGA |
| Alternate Package Description | FBGA-1020, 33 mm x 33 mm, 1 mm pitch | — |
| Temperatura de funcionamiento | 0 °C to 85 °C | 0C to +85C (commercial) |
| Lead-Free Status | Lead-free | — |
| Series | — | Stratix GX |
| Logic Elements | — | 25,660 LE |
| Number of LABs | — | 2,566 |
| Total RAM Bits | — | 1,944,576 bits |
| User I/O Count | — | 455 |
| Number of Transceivers | — | 6 channels (per Stratix GX family) |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| Core Voltage | — | 1.5 V |
| Package Dimensions | — | 33 x 33 mm |
| Ball Pitch | — | 1.0 mm |
| Tipo de montaje | — | Surface Mount |
| Lead-Free / RoHS | — | Lead-Free (per FBGA suffix family) |