EP1SGX25DF672C7ES vs EP1SGX25F672C7N Vergleich

Detaillierter Direktvergleich von EP1SGX25DF672C7ES von Intel und EP1SGX25F672C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1SGX25DF672C7ES EP1SGX25F672C7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $215,00
Product Type Field Programmable Gate Array (FPGA) —
Device Family Stratix GX —
Logic Cells 25,660 cells —
Logic Family CMOS —
Process Technology 130 nm CMOS
Versorgungsspannung 1.5 V —
I/O Count 455 I/O —
Listed Clock Frequency 4385.97 MHz —
Secondary Listed Maximum Clock 4.7 MHz —
High-Speed Serial Data Rate 500 Mbps to 3.1875 Gbps —
High-Speed Serial Direction Full-duplex —
Available Family Transceiver Configurations 4, 8, 16, or 20 channels —
Maximum Family Transceiver Bandwidth 127.5 Gbps full-duplex —
Gehäuse 672-pin FC-FBGA 672-ball FineLine BGA (FBGA672), 1.00 mm pitch
Alternate Package Description FBGA-1020, 33 mm x 33 mm, 1 mm pitch —
Betriebstemperatur 0 °C to 85 °C —
Lead-Free Status Lead-free —
Family — Stratix GX
Logic Elements — 25,660
Configurable Logic Blocks (CLBs) — 2,566
Embedded Memory (bits) — 1,944,576
Number of I/O Banks — 4
Maximum User I/O — [DATA_NEEDED: max user I/O pins]
Number of Registers — 25,660
Number of Transceivers — Up to 20
Transceiver Data Rate — 3.125 Gbps
Operating Supply Voltage (Core) — 1.5 V nominal
Betriebstemperaturbereich — 0°C to 85°C (commercial)
Montageart — Surface Mount
MSL-Level — 3
RoHS-Status — Compliant (lead-free FBGA)

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