EP1SGX25DF672I6 vs EP1SGX25DF672I7 Vergleich

Detaillierter Direktvergleich von EP1SGX25DF672I6 von Intel und EP1SGX25DF672I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1SGX25DF672I6 EP1SGX25DF672I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $145,00 $1.190,00
Series Stratix GX Stratix GX
Family Stratix GX Stratix GX (EP1SGX25)
Logic Elements 25,660 25,660
Total RAM Bits 1,944,576 1,944,576
User I/O Count 455 —
Gehäuse 672-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch —
Process Technology 130 nm CMOS CMOS 130 nm
Core Supply Voltage (VCCINT) 1.5 V —
Betriebstemperatur -40C to +85C (industrial, I6 grade) —
Temperature Grade Industrial (I6) —
Maximum Internal Frequency 5000 MHz (per datasheet header) —
Montageart Surface Mount Surface Mount (BGA)
Lead Free / RoHS Yes / Compliant —
Anzahl der Pins 672 —
DSP Blocks Yes (embedded multipliers) —
On-chip Transceivers Yes (Stratix GX embedded MGTs) —
Clock Management PLLs (on-chip) —
Logic Family / Base Technology CMOS —
Configurable Logic Blocks (CLBs) — 2,566
Number of Logic Array Blocks (LABs) — 455
Maximum Internal Clock Frequency — 4385.97 MHz
Combinatorial CLB Delay (max) — 9.48 ns
Nominal Supply Voltage — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
Operating Temperature Grade — MILITARY / Industrial
Speed Grade — I7 (slowest industrial)
Package Code — DF (672-ball FC-FBGA)
Number of Terminals — 672
Terminal Form — Ball (BGA)
Package Shape — Square
RoHS-Status — [DATA_NEEDED: RoHS status]

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