EP1SGX25DF672I7 vs EP1SGX25DF672I7N Vergleich
Detaillierter Direktvergleich von EP1SGX25DF672I7 von Intel und EP1SGX25DF672I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1SGX25DF672I7 | EP1SGX25DF672I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.190,00 | $162,00 |
| Series | Stratix GX | — |
| Family | Stratix GX (EP1SGX25) | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Total RAM Bits | 1,944,576 | — |
| Number of Logic Array Blocks (LABs) | 455 | — |
| Maximum Internal Clock Frequency | 4385.97 MHz | — |
| Combinatorial CLB Delay (max) | 9.48 ns | — |
| Process Technology | CMOS 130 nm | 130 nm CMOS |
| Nominal Supply Voltage | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Operating Temperature Grade | MILITARY / Industrial | — |
| Speed Grade | I7 (slowest industrial) | — |
| Package Code | DF (672-ball FC-FBGA) | — |
| Number of Terminals | 672 | 672 |
| Terminal Form | Ball (BGA) | Ball (BGA) |
| Package Shape | Square | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| CLBs | — | 2,566 |
| Maximum Operating Frequency | — | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) |
| Combinatorial Delay (CLB) | — | 9.48 ns max |
| High-Speed Transceiver Channels | — | 4 |
| Transceiver Data Rate | — | 500 Mbps to 3.1875 Gbps per channel |
| Core Supply Voltage (VCCINT) | — | 1.5 V |
| Gehäuse | — | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch |
| Logic Family | — | CMOS |
| Betriebstemperatur | — | 0 °C to 85 °C (industrial) |
| Lead-Free | — | Yes |