EP1SGX25DF800I6N vs EP1SGX25CF672I6 Vergleich

Detaillierter Direktvergleich von EP1SGX25DF800I6N von Intel und EP1SGX25CF672I6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1SGX25DF800I6N EP1SGX25CF672I6
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.450,00 $171,00
Family Stratix GX Stratix GX
Logic Elements [DATA_NEEDED: logic element count] 25,660
Transceiver Channels 4 to 20 channels —
Maximum Transceiver Data Rate 3.1875 Gbps per channel —
CDR / SERDES Embedded clock-data recovery and SERDES —
Memory TriMatrix memory, up to 2 Mbits —
DSP Blocks Up to 22 DSP blocks [DATA_NEEDED: DSP block count per Stratix GX device data sheet]
Hard IP PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) —
Source-Synchronous Channels 8 channels —
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Gehäuse 800-pin FineLine BGA (DF800) 672-ball FBGA (27 x 27 mm, 1 mm pitch)
Speed Grade -6 (production grade) —
Temperature Range Industrial -40C to +100C —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant (lead-free FBGA)
Protocol Support Gigabit Ethernet, SONET/SDH, PCI Express, custom serial —
Logic Array Blocks (LABs) — 2,566
Total RAM Bits — 1,944,576
User I/O Pins — 455
Core Supply Voltage — 1.425 V to 1.575 V (1.5 V typical)
Process Technology — 130 nm CMOS
Internal Clock Performance — Up to 5000 MHz
Montageart — Surface Mount
Betriebs-Sperrschichttemperatur — -40C to +100C
Transceiver Count — [DATA_NEEDED: precise number of SERDES channels per pin list]
Lead-Free — Yes

Datenblätter & Ressourcen

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