EP1SGX25DF800I6N vs EP1SGX25DF800C6N Vergleich

Detaillierter Direktvergleich von EP1SGX25DF800I6N von Intel und EP1SGX25DF800C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1SGX25DF800I6N EP1SGX25DF800C6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.450,00 $118,00
Family Stratix GX Stratix GX
Logic Elements [DATA_NEEDED: logic element count] 25,560 LEs
Transceiver Channels 4 to 20 channels —
Maximum Transceiver Data Rate 3.1875 Gbps per channel 3.1875 Gbps
CDR / SERDES Embedded clock-data recovery and SERDES —
Memory TriMatrix memory, up to 2 Mbits —
DSP Blocks Up to 22 DSP blocks Yes, embedded multiplier blocks
Hard IP PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) —
Source-Synchronous Channels 8 channels —
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL —
Gehäuse 800-pin FineLine BGA (DF800) FBGA-780 (FineLine BGA, 800-ball per JEDEC ordering code)
Speed Grade -6 (production grade) 6
Temperature Range Industrial -40C to +100C —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Protocol Support Gigabit Ethernet, SONET/SDH, PCI Express, custom serial —
Maximum Transceiver Channels — 20 channels
Process Node — [DATA_NEEDED: process node]
Core Voltage — 1.5 V
Betriebstemperatur — Commercial (0 C to +85 C)
Configuration Method — Passive Serial / Passive Parallel / Active Serial / JTAG
Transceiver Encoding — 8B/10B
Clock Data Recovery (CDR) — Yes, integrated per channel
Speichertyp — TriMatrix embedded SRAM
Montageart — Surface Mount (BGA)
Lead Free — [DATA_NEEDED: lead free status]

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