EP1SGX25F672C7N vs EP1SGX25DF672I7N Vergleich
Detaillierter Direktvergleich von EP1SGX25F672C7N von Intel und EP1SGX25DF672I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1SGX25F672C7N | EP1SGX25DF672I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $215,00 | $162,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Embedded Memory (bits) | 1,944,576 | — |
| Number of I/O Banks | 4 | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O pins] | — |
| Number of Registers | 25,660 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | 3.125 Gbps | 500 Mbps to 3.1875 Gbps per channel |
| Operating Supply Voltage (Core) | 1.5 V nominal | — |
| Betriebstemperaturbereich | 0°C to 85°C (commercial) | — |
| Process Technology | CMOS | 130 nm CMOS |
| Gehäuse | 672-ball FineLine BGA (FBGA672), 1.00 mm pitch | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch |
| Montageart | Surface Mount | Surface Mount (BGA) |
| MSL-Level | 3 | — |
| RoHS-Status | Compliant (lead-free FBGA) | [DATA_NEEDED: rohs status] |
| CLBs | — | 2,566 |
| Maximum Operating Frequency | — | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) |
| Combinatorial Delay (CLB) | — | 9.48 ns max |
| High-Speed Transceiver Channels | — | 4 |
| Core Supply Voltage (VCCINT) | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| Logic Family | — | CMOS |
| Betriebstemperatur | — | 0 °C to 85 °C (industrial) |
| Lead-Free | — | Yes |
| Terminal Form | — | Ball (BGA) |
| Number of Terminals | — | 672 |