EP1SGX25F672C7N vs EP1SGX25DF672I7N 对比
详细并排对比 EP1SGX25F672C7N 出自 Intel 和 EP1SGX25DF672I7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP1SGX25F672C7N | EP1SGX25DF672I7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $215.00 | $162.00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Embedded Memory (bits) | 1,944,576 | — |
| Number of I/O Banks | 4 | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O pins] | — |
| Number of Registers | 25,660 | — |
| Number of Transceivers | Up to 20 | — |
| Transceiver Data Rate | 3.125 Gbps | 500 Mbps to 3.1875 Gbps per channel |
| Operating Supply Voltage (Core) | 1.5 V nominal | — |
| 工作温度范围 | 0°C to 85°C (commercial) | — |
| Process Technology | CMOS | 130 nm CMOS |
| 封装 | 672-ball FineLine BGA (FBGA672), 1.00 mm pitch | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| MSL 等级 | 3 | — |
| RoHS 状态 | Compliant (lead-free FBGA) | [DATA_NEEDED: rohs status] |
| CLBs | — | 2,566 |
| Maximum Operating Frequency | — | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) |
| Combinatorial Delay (CLB) | — | 9.48 ns max |
| High-Speed Transceiver Channels | — | 4 |
| Core Supply Voltage (VCCINT) | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| Logic Family | — | CMOS |
| 工作温度 | — | 0 °C to 85 °C (industrial) |
| Lead-Free | — | Yes |
| Terminal Form | — | Ball (BGA) |
| Number of Terminals | — | 672 |