EP20K100CF324C7 vs EP20K100CF324C9 Vergleich
Detaillierter Direktvergleich von EP20K100CF324C7 von Intel und EP20K100CF324C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K100CF324C7 | EP20K100CF324C9 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $27,80 | $71,00 |
| Family | FLEX 10K | APEX 20K |
| Series | EP20K100 | APEX II |
| Logic Elements (LEs) | 4,160 | — |
| System Gates | 100,000 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Maximum RAM Bits | 49,152 | — |
| Maximum User I/O | 246 | 246 |
| Gehäuse | 324-FBGA (FineLine BGA) | 324-FBGA (FineLine BGA) |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Betriebstemperatur | 0 °C to +70 °C (commercial) | 0C to +85C (Commercial) |
| Speed Grade | C7 (slowest commercial bin) | -9 (C9) |
| Process Technology | 0.22 µm CMOS SRAM | — |
| Configuration Method | Serial PROM (EPC2/EPC4/EPC8) or JTAG | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | unknown | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 4160 |
| Typical Gates | — | 100000 |
| Core Voltage | — | 1.8 V (typical, APEX II) |
| I/O Voltage Support | — | 2.5 V / 3.3 V |
| Configuration Interface | — | JTAG (IEEE 1149.1) / Passive serial |
| Embedded System Blocks | — | Yes (ESB for RAM/ROM/CAM) |
| Lead Free | — | [DATA_NEEDED: lead-free status] |