EP20K100CF324C7ES vs EP20K100CF324C7 Vergleich
Detaillierter Direktvergleich von EP20K100CF324C7ES von Intel und EP20K100CF324C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K100CF324C7ES | EP20K100CF324C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,75 | $27,80 |
| Family | APEX-20K | FLEX 10K |
| Logic Elements / Cells | 4160 | — |
| Total System Gates | 263000 | — |
| Number of I/O | 246 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Number of Logic Elements/Cells | 4160 | — |
| Total RAM Bits | 53248 | — |
| Number of Embedded System Blocks (ESBs) | 16 | — |
| Number of PLLs | 4 | — |
| Voltage - Supply | 2.375 V to 2.625 V | — |
| Betriebstemperatur | 0C to +85C | 0 °C to +70 °C (commercial) |
| Speed Grade | C7 | C7 (slowest commercial bin) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Gehäuse / Bauform | 324-FBGA (19x19 mm) | — |
| Supplier Device Package | 324-FBGA (19x19) | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 µm CMOS SRAM |
| RoHS-Status | unknown | unknown |
| Series | — | EP20K100 |
| Logic Elements (LEs) | — | 4,160 |
| System Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum RAM Bits | — | 49,152 |
| Maximum User I/O | — | 246 |
| Gehäuse | — | 324-FBGA (FineLine BGA) |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | — | Serial PROM (EPC2/EPC4/EPC8) or JTAG |