EP20K100CF324C7ES vs EP20K100CF324C7 Comparación
Comparación detallada lado a lado de EP20K100CF324C7ES por Intel y EP20K100CF324C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP20K100CF324C7ES | EP20K100CF324C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,75 | $27,80 |
| Family | APEX-20K | FLEX 10K |
| Logic Elements / Cells | 4160 | — |
| Total System Gates | 263000 | — |
| Number of I/O | 246 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Number of Logic Elements/Cells | 4160 | — |
| Total RAM Bits | 53248 | — |
| Number of Embedded System Blocks (ESBs) | 16 | — |
| Number of PLLs | 4 | — |
| Voltage - Supply | 2.375 V to 2.625 V | — |
| Temperatura de funcionamiento | 0C to +85C | 0 °C to +70 °C (commercial) |
| Speed Grade | C7 | C7 (slowest commercial bin) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Encapsulado / Carcasa | 324-FBGA (19x19 mm) | — |
| Supplier Device Package | 324-FBGA (19x19) | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 µm CMOS SRAM |
| Estado RoHS | unknown | unknown |
| Series | — | EP20K100 |
| Logic Elements (LEs) | — | 4,160 |
| System Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum RAM Bits | — | 49,152 |
| Maximum User I/O | — | 246 |
| Encapsulado | — | 324-FBGA (FineLine BGA) |
| Supply Voltage - Core | — | 1.8 V |
| Supply Voltage - I/O | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | — | Serial PROM (EPC2/EPC4/EPC8) or JTAG |