EP20K100CF324C9 vs EP20K100CF324C8 Vergleich
Detaillierter Direktvergleich von EP20K100CF324C9 von Intel und EP20K100CF324C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K100CF324C9 | EP20K100CF324C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $71,00 | $50,00 |
| Series | APEX II | — |
| Family | APEX 20K | APEX-20K |
| Logic Elements | 4160 | 4,160 |
| Typical Gates | 100000 | 100,000 |
| Maximum User I/O | 246 | 246 |
| Gehäuse | 324-FBGA (FineLine BGA) | 324-FBGA (FineLine BGA) |
| Betriebstemperatur | 0C to +85C (Commercial) | 0°C to +85°C (commercial) |
| Speed Grade | -9 (C9) | C8 (commercial, 8 ns) |
| Montageart | Surface Mount | — |
| Core Voltage | 1.8 V (typical, APEX II) | 1.8 V typical |
| I/O Voltage Support | 2.5 V / 3.3 V | — |
| Configuration Interface | JTAG (IEEE 1149.1) / Passive serial | JTAG (IEEE 1149.1), serial/parallel |
| Embedded System Blocks | Yes (ESB for RAM/ROM/CAM) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Embedded RAM Bits | — | 53,248 |
| Embedded System Blocks (ESBs) | — | 26 |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | 0.18 µm CMOS |
| I/O Standards | — | LVCMOS, LVTTL, SSTL, HSTL |
| Design Software | — | Quartus II (legacy) |