EP20K100FC324-1V vs EP20K60EFC324-2N Vergleich
Detaillierter Direktvergleich von EP20K100FC324-1V von Intel und EP20K60EFC324-2N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K100FC324-1V | EP20K60EFC324-2N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $118,40 | $52,73 |
| Series | APEX-20K® | APEX-20KE |
| Number of Logic Elements / Cells | 4160 | — |
| Total RAM Bits | 53248 | 32,768 |
| Number of Gates (typical) | 100000 | — |
| Number of I/O | 252 | 196 |
| Number of LABs/CLBs | [DATA_NEEDED: number of Logic Array Blocks] | — |
| Number of EABs | [DATA_NEEDED: number of Embedded Array Blocks] | — |
| Supply Voltage - Core (VCCINT) | 2.375 V to 2.625 V | — |
| Supply Voltage - I/O (VCCIO) | 3.0 V / 3.3 V / 5.0 V tolerant (per I/O standard) | — |
| Speed Grade | -1V (commercial) | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 324-FBGA (FineLine BGA, 19x19 mm) | 324-BGA (FineLine BGA, 19x19 mm) |
| Supplier Device Package | 324-FBGA | 324-FBGA (19x19) |
| Number of PLLs | 4 | — |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, SSTL, GTL+, HSTL | — |
| Architecture | MultiCore (LUT + product-term + embedded memory) | MultiCore (LUT + ESB memory + product-term) |
| Programming Interface | JTAG (IEEE 1149.1) / in-system | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | unknown |
| Family | — | APEX 20K |
| Number of Logic Elements/Cells | — | 2,560 |
| Total System Gates | — | 60,000 |
| Number of Logic Array Blocks (LABs/CLBs) | — | 2,560 |
| Core Voltage Supply | — | 1.71 V to 1.89 V (1.8 V typ.) |
| Internal Frequency (max) | — | 200 MHz |
| Propagation Delay | — | 1.72 ns |
| Operating Temperature Range (TJ) | — | 0 °C to 85 °C (commercial) |
| Process Technology | — | 0.22 µm CMOS |
| Configuration Method | — | Passive Serial / JTAG (IEEE 1149.1) |