EP20K400CF672C8AA vs EP20K400CF672C8N Vergleich

Detaillierter Direktvergleich von EP20K400CF672C8AA von Intel und EP20K400CF672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP20K400CF672C8AA EP20K400CF672C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $145,00 $68,40
Family APEX 20K APEX 20KC
Number of Logic Elements/Cells 16640 —
Number of Logic Units (LEs) [DATA_NEEDED: number of LUs] —
Embedded System Blocks (ESBs) 212 —
On-chip RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of User I/O Pins 488 —
Package Type 672-ball Fine-Pitch BGA (FBGA) —
Number of Pins/Balls 672 —
Supply Voltage (Core) 2.5 V 1.8 V
I/O Standards Supported LVTTL, LVCMOS, PCI, SSTL, HSTL (multi-voltage I/O) —
Propagation Delay [DATA_NEEDED: typical propagation delay] 2.5 ns (C speed grade)
Betriebstemperatur 0 C to 85 C (Commercial) 0 °C to +85 °C (commercial)
Montageart Surface Mount Surface Mount (BGA)
Packaging Tray —
Feuchtigkeitsempfindlichkeitsgrad (MSL) 3 (168 Hours) —
Configuration Interface JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous —
RoHS-Status [DATA_NEEDED: RoHS status] —
Device Logic Elements — 16,640 (Macros / Cells)
Maximum System Gates — 400,000
Maximum User I/O — 488
Embedded Memory — 212,992 bits
Gehäuse — 672-ball FineLine BGA (FC-FBGA672)
Package Body Size — 27 × 27 mm
Ball Pitch — 1.0 mm
Logic Family — CMOS
Process Technology — 0.15 µm all-layer copper CMOS
Maximum Internal Frequency — 301.21 MHz
Lead-Free / RoHS — Yes (N suffix)

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