EP20K400GC655-1 vs EP20K400GC655-2X Vergleich
Detaillierter Direktvergleich von EP20K400GC655-1 von Intel und EP20K400GC655-2X von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP20K400GC655-1 - 400K Gate APEX 20K FPGA, 655-pin CPGA | Intel/Altera
EP20K400GC655-1 ObsoleteSpezifikationsvergleich
| Parameter | EP20K400GC655-1 | EP20K400GC655-2X |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $135,00 | $175,00 |
| Family | APEX 20K | APEX 20K |
| Series | EP20K400 | APEX-20KC® |
| Logic Elements | 16,640 | — |
| Maximum Gates | 1,052,000 | — |
| Typical Gates | 400,000 | — |
| Embedded System Blocks (ESBs) | 4 | — |
| Total RAM Bits | 212,992 | 212992 |
| Maximum User I/O | 502 | — |
| Dedicated Inputs | 6 | — |
| Process Technology | 0.22 µm CMOS | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | 2.5 V |
| I/O Supply Voltage | 3.3 V | — |
| Maximum Internal Frequency | 250 MHz | — |
| Propagation Delay | 2.5 ns | — |
| Gehäuse | 655-pin CPGA (Ceramic Pin Grid Array) | — |
| Pin-Anzahl | 655 | — |
| Montageart | Through-Hole | Through-hole (CPGA) |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | [DATA_NEEDED: temperature grade] |
| Configuration Modes | Passive Serial, Passive Parallel Async, Passive Parallel Sync | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| RoHS-Status | Non-compliant (contains lead in ceramic package) | unknown |
| Logic Elements / Cells | — | 16640 |
| System Gates | — | 400000 |
| Number of I/O | — | 496 |
| Number of Dedicated Inputs | — | 6 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of Logic Array Blocks] |
| Number of EABs | — | [DATA_NEEDED: number of Embedded Array Blocks] |
| Maximum Operating Frequency | — | 200 MHz |
| I/O Supply Voltage (MultiVolt) | — | 2.5 V / 3.3 V / 5 V |
| Package Type | — | 655-BCPGA (SPGA655) |
| Package Body Material | — | CERAMIC, metal-sealed cofired grid array |
| Package Dimensions | — | 47 x 47 mm |
| Peak Reflow Temperature | — | 220 °C |
| Programmability | — | In-system, JTAG (IEEE 1149.1) |