EP20K400GI655-2X vs EP20K400GI655-1X Vergleich
Detaillierter Direktvergleich von EP20K400GI655-2X von Intel und EP20K400GI655-1X von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Altera
EP20K400GI655-1X - 400K Gate APEX 20K FPGA, 16640 Logic Elements, 655-Pin CPGA | Altera (Intel)
EP20K400GI655-1X ObsoleteSpezifikationsvergleich
| Parameter | EP20K400GI655-2X | EP20K400GI655-1X |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $195,00 | $160,00 |
| Series | APEX-20K | — |
| Family | APEX-20K (loadable PLD / FPGA) | APEX 20K |
| Logic Elements (LEs) | 16,640 | — |
| System Gates | 400,000 | — |
| Maximum User I/O | 502 | — |
| Total I/O Lines | 496 (bidirectional) + 4 (dedicated inputs) | — |
| Embedded Memory (bits) | 212,992 | — |
| Nominal Core Supply Voltage | 2.5 V | — |
| Supply Voltage Range | 2.375 V to 2.625 V | — |
| I/O Supply Voltages | 2.5 V / 3.3 V | — |
| Process Technology | CMOS | CMOS, SRAM-based configuration |
| Propagation Delay (typical, -2 grade) | 3.1 ns | — |
| Gehäuse | 655-ball FineLine BGA (SPGA655, 47x47 mm) | — |
| Package Code | SPGA655, 47x47 | — |
| Surface Mount | Yes (BGA) | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 1 | 1 |
| Operating Temperature (industrial -X grade) | -40C to +85C (industrial) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | Compliant |
| Qualification | Not Qualified (per distributor listing) | — |
| JTAG Support | IEEE 1149.1 boundary-scan / programming | — |
| Device | — | EP20K400 |
| Logic Elements | — | 16640 |
| Number of Terminals | — | 655 |
| User I/O Lines | — | 502 |
| Dedicated Inputs | — | 4 |
| Package Type | — | Ceramic Pin Grid Array (CPGA) |
| Package Code (JESD-30) | — | S-CPGA-P655 |
| Package Equivalence Code | — | SPGA655,47X47 |
| Package Body Material | — | CERAMIC (metal-sealed co-fired) |
| Speed Grade | — | -1 |
| Propagation Delay | — | 2.5 ns (typical for -1 grade) |
| Peak Reflow Temperature | — | 220 C |
| Betriebstemperatur | — | -40 C to +85 C (industrial) |
| Montageart | — | Through-Hole (PGA) |