EP20K400PI655-2X vs EP20K400GC655-2X Vergleich
Detaillierter Direktvergleich von EP20K400PI655-2X von Intel und EP20K400GC655-2X von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP20K400PI655-2X - APEX 20K 400K Gates FPGA, 655-Pin PQFP | Intel / Altera
EP20K400PI655-2X ObsoleteSpezifikationsvergleich
| Parameter | EP20K400PI655-2X | EP20K400GC655-2X |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $105,00 | $175,00 |
| Family | APEX 20K | APEX 20K |
| Device Series | EP20K400 | — |
| Speed Grade | -2X | — |
| Maximum Logic Elements | 16,640 | — |
| Maximum System Gates | 400,000 | — |
| Maximum RAM Bits | 166,400 | — |
| Embedded System Blocks (ESBs) | 104 | — |
| Maximum User I/O Pins | 488 | — |
| Maximum PLLs | 4 | — |
| Gehäuse | PQFP-655 (Power Quad Flat Pack) | — |
| Betriebstemperatur | -40C to +85C (Industrial) | [DATA_NEEDED: temperature grade] |
| Core Voltage | 3.3 V | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Montageart | Surface Mount | Through-hole (CPGA) |
| Configuration Method | Serial / Parallel / JTAG | — |
| Process Technology | 0.18 um CMOS | 0.22 µm CMOS |
| Lead-Free / RoHS | [DATA_NEEDED: lead-free status] | — |
| Lebenszyklusstatus | Obsolete (legacy Altera APEX 20K family) | — |
| Series | — | APEX-20KC® |
| Logic Elements / Cells | — | 16640 |
| System Gates | — | 400000 |
| Total RAM Bits | — | 212992 |
| Number of I/O | — | 496 |
| Number of Dedicated Inputs | — | 6 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of Logic Array Blocks] |
| Number of EABs | — | [DATA_NEEDED: number of Embedded Array Blocks] |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage (MultiVolt) | — | 2.5 V / 3.3 V / 5 V |
| Package Type | — | 655-BCPGA (SPGA655) |
| Package Body Material | — | CERAMIC, metal-sealed cofired grid array |
| Package Dimensions | — | 47 x 47 mm |
| Peak Reflow Temperature | — | 220 °C |
| Programmability | — | In-system, JTAG (IEEE 1149.1) |
| RoHS-Status | — | unknown |