EP20K600CB672C8 vs EP20K600CEF672C7 Vergleich

Detaillierter Direktvergleich von EP20K600CB672C8 von Intel und EP20K600CEF672C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP20K600CB672C8 EP20K600CEF672C7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $245,00 $98,40
Series APEX 20KC APEX 20KC
Family APEX-20KC® APEX 20KC (Enhanced Configuration)
Number of Logic Elements/Cells 24320 —
Total RAM Bits 311296 —
Number of I/O 508 —
Number of Gates 600000 —
Voltage - Supply 1.71 V to 1.89 V (core); 3.0 V to 3.6 V (I/O) —
Montageart Surface Mount —
Betriebstemperatur 0 °C to +85 °C (commercial) 0 °C to +85 °C (commercial)
Gehäuse / Bauform 672-BBGA, FCBGA (27 x 27 mm) —
Supplier Device Package 672-FBGA (27 x 27) —
Speed Grade C8 (approx. 301 MHz internal) —
Process Technology 0.15 µm CMOS 0.15 µm CMOS, all-layer copper
PLLs 4 —
I/O Standards LVTTL, LVCMOS, SSTL, HSTL, GTL+, PCI 3.3 V —
RoHS-Status Unknown (legacy part, pre-RoHS era) [DATA_NEEDED: RoHS status]
Lead Free Unknown —
Manufacturer — Intel (formerly Altera)
Device Type — FPGA / Loadable PLD
Logic Elements / Cells — 24,320
Gate Count (typical) — 600,000 gates
Maximum Operating Frequency — 375.94 MHz
Propagation Delay — 1.48 ns (typ)
User I/Os — 488
Core Supply Voltage — 1.8 V
Gehäuse — 672-ball FineLine BGA (FC-FBGA)
Package Code — BGA-652, 45 x 45 mm, 1.27 mm pitch
Configuration — SRAM-based, serial or parallel (EPC)
Embedded Memory — EAB blocks (dual-port RAM with byte enables)
LVDS Support — True-LVDS channels integrated
MultiVolt I/O — 1.8 V, 2.5 V, 3.3 V interfaces
External Memory Interface — DDR SDRAM, QDR SRAM
JTAG Support — IEEE 1149.1 boundary-scan

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