EP20K600CEF672C7 vs EP20K600CF672 Vergleich

Detaillierter Direktvergleich von EP20K600CEF672C7 von Intel und EP20K600CF672 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP20K600CF672 EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 [data_needed: lifecycle status]

Spezifikationsvergleich

Parameter EP20K600CEF672C7 EP20K600CF672
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete [DATA NEEDED: Lifecycle Status]
Lagerstatus In Stock In Stock
Stückpreis (USD) $98,40 $0,00
Manufacturer Intel (formerly Altera) Altera / Intel
Series APEX 20KC —
Family APEX 20KC (Enhanced Configuration) —
Device Type FPGA / Loadable PLD —
Logic Elements / Cells 24,320 —
Gate Count (typical) 600,000 gates —
Maximum Operating Frequency 375.94 MHz —
Propagation Delay 1.48 ns (typ) 1.48 ns for supplied EP20K600CF672C9N/C8N references
User I/Os 488 —
Core Supply Voltage 1.8 V —
Process Technology 0.15 µm CMOS, all-layer copper 0.15 um all-layer copper-metal process for supplied family references
Gehäuse 672-ball FineLine BGA (FC-FBGA) —
Package Code BGA-652, 45 x 45 mm, 1.27 mm pitch —
Betriebstemperatur 0 °C to +85 °C (commercial) 0 C to 85 C for supplied EP20K600CF672C9N/C8N references
Configuration SRAM-based, serial or parallel (EPC) —
Embedded Memory EAB blocks (dual-port RAM with byte enables) [DATA_NEEDED: embedded memory capacity]
LVDS Support True-LVDS channels integrated —
MultiVolt I/O 1.8 V, 2.5 V, 3.3 V interfaces —
External Memory Interface DDR SDRAM, QDR SRAM —
JTAG Support IEEE 1149.1 boundary-scan —
RoHS-Status [DATA_NEEDED: RoHS status] unknown
Product Type — Field-Programmable Gate Array (FPGA)
Product Family — APEX-20KC
User I/O Lines — 508 I/O
Logic Elements — [DATA_NEEDED: logic element count]
Device Type Listed by Supplied References — SPLD
Performance Claim — Up to 35% faster than APEX 20KE devices
Package Type — 672-ball BGA, FCBGA
Package Dimensions — 45 mm x 45 mm
Ball Pitch — 1.27 mm
Montageart — Surface Mount
Configuration Device Type — Enhanced Configuration (EPC) device
Core Voltage — [DATA_NEEDED: core supply voltage]
I/O Voltage — [DATA_NEEDED: I/O supply voltage]
Configuration Memory — [DATA_NEEDED: configuration memory type and capacity]
REACH Status — unknown
AEC-Q100 Status — unknown

Datenblätter & Ressourcen

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