EP20K600CEF672C7 vs EP20K600CF672 Comparación

Comparación detallada lado a lado de EP20K600CEF672C7 por Intel y EP20K600CF672 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Intel
EP20K600CF672 EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel

EP20K600CF672 [data_needed: lifecycle status]

Comparación de especificaciones

Parámetro EP20K600CEF672C7 EP20K600CF672
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Obsolete [DATA NEEDED: Lifecycle Status]
Estado del stock In Stock In Stock
Precio unitario (USD) $98,40 $0,00
Manufacturer Intel (formerly Altera) Altera / Intel
Series APEX 20KC —
Family APEX 20KC (Enhanced Configuration) —
Device Type FPGA / Loadable PLD —
Logic Elements / Cells 24,320 —
Gate Count (typical) 600,000 gates —
Maximum Operating Frequency 375.94 MHz —
Propagation Delay 1.48 ns (typ) 1.48 ns for supplied EP20K600CF672C9N/C8N references
User I/Os 488 —
Core Supply Voltage 1.8 V —
Process Technology 0.15 µm CMOS, all-layer copper 0.15 um all-layer copper-metal process for supplied family references
Encapsulado 672-ball FineLine BGA (FC-FBGA) —
Package Code BGA-652, 45 x 45 mm, 1.27 mm pitch —
Temperatura de funcionamiento 0 °C to +85 °C (commercial) 0 C to 85 C for supplied EP20K600CF672C9N/C8N references
Configuration SRAM-based, serial or parallel (EPC) —
Embedded Memory EAB blocks (dual-port RAM with byte enables) [DATA_NEEDED: embedded memory capacity]
LVDS Support True-LVDS channels integrated —
MultiVolt I/O 1.8 V, 2.5 V, 3.3 V interfaces —
External Memory Interface DDR SDRAM, QDR SRAM —
JTAG Support IEEE 1149.1 boundary-scan —
Estado RoHS [DATA_NEEDED: RoHS status] unknown
Product Type — Field-Programmable Gate Array (FPGA)
Product Family — APEX-20KC
User I/O Lines — 508 I/O
Logic Elements — [DATA_NEEDED: logic element count]
Device Type Listed by Supplied References — SPLD
Performance Claim — Up to 35% faster than APEX 20KE devices
Package Type — 672-ball BGA, FCBGA
Package Dimensions — 45 mm x 45 mm
Ball Pitch — 1.27 mm
Tipo de montaje — Surface Mount
Configuration Device Type — Enhanced Configuration (EPC) device
Core Voltage — [DATA_NEEDED: core supply voltage]
I/O Voltage — [DATA_NEEDED: I/O supply voltage]
Configuration Memory — [DATA_NEEDED: configuration memory type and capacity]
REACH Status — unknown
AEC-Q100 Status — unknown

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