EP20K600CF672-2X vs EP20K600CF672 Vergleich
Detaillierter Direktvergleich von EP20K600CF672-2X von Altera und EP20K600CF672 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Spezifikationsvergleich
| Parameter | EP20K600CF672-2X | EP20K600CF672 |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $138,00 | $0,00 |
| Family | APEX 20KC | — |
| Maximum Logic Elements | 24,320 | — |
| Typical Gates | 600,000 | — |
| Maximum User I/O Pins | 508 | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Maximum Embedded RAM | 311,296 bits | — |
| Speed Grade | -2 | — |
| Gehäuse | 672-ball FineLine BGA (CF672) | — |
| Operating Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS | — |
| Configuration Mode | EPC (Enhanced Configuration) devices | — |
| Betriebstemperatur | [DATA_NEEDED: temperature grade] | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Process Technology | 0.18 um CMOS | 0.15 um all-layer copper-metal process for supplied family references |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Propagation Delay | — | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |