EP20K600CF672-2X vs EP20K600CF672 Comparaison
Comparaison détaillée côte à côte de EP20K600CF672-2X par Altera et EP20K600CF672 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Comparaison des spécifications
| Paramètre | EP20K600CF672-2X | EP20K600CF672 |
|---|---|---|
| Marque | Altera | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $138,00 | $0,00 |
| Family | APEX 20KC | — |
| Maximum Logic Elements | 24,320 | — |
| Typical Gates | 600,000 | — |
| Maximum User I/O Pins | 508 | — |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Maximum Embedded RAM | 311,296 bits | — |
| Speed Grade | -2 | — |
| Boîtier | 672-ball FineLine BGA (CF672) | — |
| Operating Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS | — |
| Configuration Mode | EPC (Enhanced Configuration) devices | — |
| Température de fonctionnement | [DATA_NEEDED: temperature grade] | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Process Technology | 0.18 um CMOS | 0.15 um all-layer copper-metal process for supplied family references |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Propagation Delay | — | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |