EP20K600CF672C8N vs EP20K600CF672 Vergleich
Detaillierter Direktvergleich von EP20K600CF672C8N von Intel und EP20K600CF672 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Spezifikationsvergleich
| Parameter | EP20K600CF672C8N | EP20K600CF672 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | [DATA NEEDED: Lifecycle Status] |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $108,00 | $0,00 |
| Device Type | SPLD | — |
| Product Type | FPGA / programmable logic device | Field-Programmable Gate Array (FPGA) |
| Family | APEX 20KC | — |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| Gehäuse | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| Versorgungsspannung | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Fabrication Process | 0.15 µm | — |
| Betriebstemperatur | 0°C to 85°C | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| Montageart | Surface mount | Surface Mount |
| RoHS-Status | unknown | unknown |
| REACH Status | unknown | unknown |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Wärmewiderstand | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Device Type Listed by Supplied References | — | SPLD |
| Process Technology | — | 0.15 um all-layer copper-metal process for supplied family references |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| AEC-Q100 Status | — | unknown |