EP20K600CF672C8N vs EP20K600CF672 비교
다음의 상세 나란히 비교: EP20K600CF672C8N 제조: Intel 및 EP20K600CF672 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]사양 비교
| 파라미터 | EP20K600CF672C8N | EP20K600CF672 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | [DATA NEEDED: Lifecycle Status] |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $108.00 | $0.00 |
| Device Type | SPLD | — |
| Product Type | FPGA / programmable logic device | Field-Programmable Gate Array (FPGA) |
| Family | APEX 20KC | — |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | — |
| Package Terminals | 652 pins | — |
| 패키지 | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| 공급 전압 | 1.8 V | — |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Fabrication Process | 0.15 µm | — |
| 동작 온도 | 0°C to 85°C | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| 실장 유형 | Surface mount | Surface Mount |
| RoHS 상태 | unknown | unknown |
| REACH Status | unknown | unknown |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| 열 저항 | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Device Type Listed by Supplied References | — | SPLD |
| Process Technology | — | 0.15 um all-layer copper-metal process for supplied family references |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| AEC-Q100 Status | — | unknown |