EP2A15F672C7 vs EP2A15F672C7N Vergleich
Detaillierter Direktvergleich von EP2A15F672C7 von Intel und EP2A15F672C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A15F672C7 | EP2A15F672C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $98,00 | $171,00 |
| Series | APEX II (EP2A15) | — |
| Family | APEX II FPGA | APEX II |
| Logic Elements (LE) | 16,640 | — |
| Total System Gates | 425,984 | — |
| Maximum User I/O | 492 | — |
| Embedded Memory Bits | 425,984 | 425,984 |
| Number of Macrocells / Logic Units | 16,640 | — |
| Propagation Delay (tPD) | 1.69 ns | — |
| Core Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper CMOS |
| High-Speed I/O Standard | True-LVDS, LVPECL, PCML, HyperTransport | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Gehäuse | 672-ball FineLine BGA (FCBGA) | 672-ball FC-FBGA (FineLine BGA) |
| Package Dimensions | 27 mm × 27 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | Commercial (0°C to +85°C) | Commercial (0C to +85C) |
| Speed Grade | C7 | -7 |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements (Cells) | — | 16,640 |
| User I/Os | — | 492 |
| Metal Layers | — | Up to 8 |
| Maximum Internal Frequency | — | 500 MHz |
| I/O Standards Supported | — | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Methods | — | JTAG, Passive Serial |