EP2A15F672C7AA vs EP2A15B724C9 Vergleich
Detaillierter Direktvergleich von EP2A15F672C7AA von Intel und EP2A15B724C9 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2A15F672C7AA - APEX II FPGA 600K Gates 1.5V FC-FBGA672
EP2A15F672C7AA ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP2A15F672C7AA | EP2A15B724C9 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $215,00 | $268,50 |
| Family | APEX II | APEX II (EP2A15) |
| Typical Gates | 600K | — |
| Maximum System Gates | 1.4M | — |
| Logic Elements (LEs) | 16,640 | — |
| Maximum User I/O | 492 | — |
| Operating Frequency (internal) | 500 MHz | — |
| LVDS Data Rate | 1 Gbps True-LVDS | Up to 1 Gbps (True-LVDS) |
| Core Voltage | 1.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport | — |
| MultiVolt I/O Bank Voltages | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Embedded Memory | Dual-port RAM blocks + CAM blocks | — |
| PLLs | 4 enhanced PLLs | — |
| Gehäuse | 672-ball FC-FBGA (flip-chip) | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Process Technology | 0.15 micrometer all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper (up to 8 metal layers) |
| Programming Interfaces | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Lifecycle | Last-Time-Buy / EOL announced Nov-Dec 2016 | — |
| RoHS-Status | Compliant (per Full-Electronic listing) | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II |
| Logic Elements | — | 16640 |
| Number of Gates | — | 600000 |
| Embedded Memory (RAM bits) | — | 425984 |
| User I/O Count | — | 492 |
| Supply Voltage (Core) | — | 1.5 V |
| I/O Voltages Supported | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Maximum Internal Frequency | — | 500 MHz |
| Interface Standards | — | LVDS, LVPECL, PCML, HyperTransport |
| Embedded Memory Type | — | ESB - dual-port RAM / ROM / FIFO / CAM |
| Clock Management | — | On-chip PLLs |
| Betriebstemperatur | — | Commercial (0 °C to +85 °C) |
| Montageart | — | Surface Mount |