EP2A15F672C7AA vs EP2A15B724C9 Comparación
Comparación detallada lado a lado de EP2A15F672C7AA por Intel y EP2A15B724C9 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A15F672C7AA | EP2A15B724C9 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $215,00 | $268,50 |
| Family | APEX II | APEX II (EP2A15) |
| Typical Gates | 600K | — |
| Maximum System Gates | 1.4M | — |
| Logic Elements (LEs) | 16,640 | — |
| Maximum User I/O | 492 | — |
| Operating Frequency (internal) | 500 MHz | — |
| LVDS Data Rate | 1 Gbps True-LVDS | Up to 1 Gbps (True-LVDS) |
| Core Voltage | 1.5 V | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport | — |
| MultiVolt I/O Bank Voltages | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Embedded Memory | Dual-port RAM blocks + CAM blocks | — |
| PLLs | 4 enhanced PLLs | — |
| Encapsulado | 672-ball FC-FBGA (flip-chip) | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Process Technology | 0.15 micrometer all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper (up to 8 metal layers) |
| Programming Interfaces | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Lifecycle | Last-Time-Buy / EOL announced Nov-Dec 2016 | — |
| Estado RoHS | Compliant (per Full-Electronic listing) | [DATA_NEEDED: RoHS status] |
| Series | — | APEX II |
| Logic Elements | — | 16640 |
| Number of Gates | — | 600000 |
| Embedded Memory (RAM bits) | — | 425984 |
| User I/O Count | — | 492 |
| Supply Voltage (Core) | — | 1.5 V |
| I/O Voltages Supported | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Maximum Internal Frequency | — | 500 MHz |
| Interface Standards | — | LVDS, LVPECL, PCML, HyperTransport |
| Embedded Memory Type | — | ESB - dual-port RAM / ROM / FIFO / CAM |
| Clock Management | — | On-chip PLLs |
| Temperatura de funcionamiento | — | Commercial (0 °C to +85 °C) |
| Tipo de montaje | — | Surface Mount |